Fraunhofer USA Center Midwest CMW, Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM (Dresden)
The trend toward electronics miniaturization and higher-efficiency thermal heat exchangers presents major challenges in electronic packaging, cooling, and temperature control. As a result, heat flux directly impacts both consumer electronics and the manufacturing tools used to fabricate these devices, driving industrial-scale challenges. On average, global heat flux demands have risen by 7.8% per year over the last decade. This increase is driven by advanced microelectronics applications such as artificial intelligence, and demands are projected to continue growing, with the global thermal management market expected to reach $12-14 billion by 2030.
One leading solution to manage increased heat flux and mitigate damage to electronic components is the integration of advanced heat exchanger materials and custom-shaped structures that cannot be produced through traditional subtractive manufacturing. By leveraging additive manufacturing and combining advanced materials, such as copper–diamond composites or layered copper–ceramic heat spreaders, custom thermal transfer devices can provide improved heat flux management. This reduces thermal mismatches, minimizes assembly-related heat loss, and ultimately extends device lifetimes.
To address these needs and advance multi-material integration of
copper, ceramics, and copper–diamond composites, scientists at
Fraunhofer USA CMW, in collaboration with colleagues at the Fraunhofer Institute for Manufacturing Technology and Advanced Materials IFAM, have developed novel additive manufacturing
approaches. Two distinct processing competencies have been
established to create complex copper and ceramic structures:
Gel Casting: Metal or ceramic powders are cast using a gelatin binder into 3D-printed molds. After post-processing and sintering, this approach yields dense, complex geometries and multi-material stacks composed of copper, alumina, and copper–diamond. Based on the mold structure a variety of complex structures can be fabricated.
Extrusion-Based 3D Printing: A polymer-based feedstock has been developed to suspend metal or ceramic powders within a printable plastic matrix. Using traditional extrusion, complex multilayered structures were fabricated simultaneously. Following debinding and sintering, this method also produced dense copper, alumina, and copper–diamond components of various geometries that could be used for thermal transfer interfaces.
While presenting these results at a conference, our team initiated a collaboration with New Aim3D GmbH, an additive manufacturing company based in Rostock, Germany. This partnership enabled Fraunhofer USA CMW to become the first U.S. customer for their ExAM 255 industrial pellet-based 3D printer and positioned our facility in East Lansing, Michigan, as a demonstration site for interested manufacturers. The ExAM 255 offers production-ready scalability, allowing our research to transition from technologically challenging and expensive filament-based printing to industrially viable pellet-based additive manufacturing of metals and ceramics.
Together, our team has demonstrated novel heat spreaders with broad application potential, enabling our partners to mitigate heat, reduce costs, and unlock new design freedom through additive manufacturing.